ADVISORY COMMITTEE
Leopoldo Angrisani, University of Napoli Federico II, Italy (IEEE Fellow)
Tony Quek, Singapore University of Technology and Design, Singapore (Fellow of Academy of Engineering Singapore, IEEE Fellow)
Jiangzhou Wang, University of Kent, UK (International Member of the Chinese Academy of Engineering (CAE), Fellow of Royal Academy of Engineering, IEEE Fellow, IET Fellow)
Kun Yang, Nanjing University, China (Member of Academia Europaea (MAE), IEEE Fellow, IET Fellow, ACM Distinguished Scientist)
GENERAL CONFERENCE CHAIR
Krzysztof
Szczypiorski, Warsaw University of Technology, Poland
CONFERENCE CO-CHAIRS
Kwok L. Chung, Huizhou University, China
Qingsheng Zeng, INRS-EMT,
Canada
TECHNICAL PROGRAM CHAIRS
Nobuo Funabiki, Okayama University, Japan
Pascal Lorenz, University of Haute Alsace, France
Chow-Yen-Desmond Sim, Feng Chia University, Taiwan, China
TECHNICAL PROGRAM CO-CHAIRS
Christos Bouras, University of Patras, Greece
Li Deng, Beijing University of Posts and Telecommunications, China
Sanshan Sun, Sichuan Normal Univeristy, China
Jie Tang, South China University of Technology, China
Sixing Yin, Beijing University of Posts and Telecommunications, China
Yang Yue, Xi'an Jiaotong University, China
Jianfeng Zhu, South China University of Technology, China
LOCAL ORGANIZING CHAIRS
Botao Feng, Shenzhen University, China
Weijun Hong, Beijing University of Posts and Telecommunications, China
Yanyan Liang, Macau University of Science and Technology, China
PUBLICITY CHAIRS
Liwei Yang, China Agricultural University, China
Xujian Zhao, Southwest University of Science and Technology, China
Danyang Zheng, Southwest Jiaotong University, China
SPECIAL SESSION CHAIR
Bo Li, Ningxia University, China
TECHNICAL PROGRAM COMMITTEE
Yasser M. Alginahi, Adrian College, USA
Shahzad Ashraf, Hohai University, China
Sivaparthipan CB, Tagore Institute of Engineering and Technology, India
Dragana Bajić, University of Novi Sad, Serbia
Paulo Batista, University of Évora, Portugal
Radhakrishna Bhat, Manipal Institute of Technology, India
Huifang Chen, Zhejiang University, China
Wanyang Dai, Nanjing University, China
Mohanarangan Veerappermal Devarajan, Ernst & Young (EY), USA
Thirusubramanian Ganesan, Cognizant Technology Solutions, USA
Kalyan Gattupalli, Yash Tek Inc, Canada
Shri Kant, Sharda University, India
Joel Lopes, Cruise LLC, USA
Tianming Ma, Shanghai University of Engineering Science, China
Vijaykumar Mamidala, Conga (Apttus), USA
Paolo Mercorelli, Leuphana University of Lueneburg, Germany
Poorva. R, SCSVMV University, India
Luca Reggiani, Politecnico di Milano, Italy
Erica Teixeira Gomes de Sousa, Federal Rural University of Pernamnuco, Brazil
Abdel-Badeeh M. Salem, Ain Shams University, Egypt
K. Ruba Soundar, Mepco Schlenk Engineering College (Autonomous), India
Mario Tanda, University of Naples Federico II, Italy
Vinod Kumar Verma, Sant Longowal Institute of Engineering and Technology, India
Xuanzhong Wang, Beijing Fibrlink Communications Co., LTD, China
Aulia Arif Wardana, Wrocław University of Science and Technology, Poland
Yew Kee Wong, Hong Kong Chu Hai College, China
Apostolos Xenakis, University of Thessaly, Greece
Rama Krishna Mani Kanta Yalla, Amazon Web Services, USA
Akhil Raj Gaius Yallamelli, Amazon Web Services Inc, USA
Fei Yuan, Ryerson University, Canada
* The above list is arranged by surname alphabet order