ADVISORY COMMITTEE
Leopoldo Angrisani, University of Napoli Federico II, Italy (IEEE Fellow)
Tony Quek, Singapore University of Technology and Design, Singapore (Fellow of Academy of Engineering Singapore, IEEE Fellow)
Jiangzhou Wang, University of Kent, UK (International Member of the Chinese Academy of Engineering (CAE), Fellow of Royal Academy of Engineering, IEEE Fellow, IET Fellow)
Kun Yang, Nanjing University, China (Member of Academia Europaea (MAE), IEEE Fellow, IET Fellow, ACM Distinguished Scientist)
GENERAL CONFERENCE CHAIRS
Krzysztof Szczypiorski, Warsaw University of Technology, Poland
Peichang Zhang, Shenzhen University, China (Vice Dean of College of Electronics and Information Engineering)
CONFERENCE CO-CHAIRS
Kwok L. Chung, Guangzhou Institute of Science and Technology, China
Qingsheng Zeng, INRS-EMT,
Canada
TECHNICAL PROGRAM CHAIRS
Nobuo Funabiki, Okayama University, Japan
Haiming Huang, Shenzhen
University, China
Yingsong Li, Anhui University, China (Vice Dean of
School of Electronic and Information Engineering)
Pascal Lorenz,
University of Haute Alsace, France
Guoxiang Shu, Shenzhen University,
China
Chow-Yen-Desmond Sim, Feng Chia University, Taiwan, China
Xingquan Wang, Gannan Normal University, China
TECHNICAL PROGRAM CO-CHAIRS
Christos Bouras, University of Patras, Greece
Li Deng, Beijing University of Posts and Telecommunications, China
Sanshan Sun, Sichuan Normal Univeristy, China
Jie Tang, South China University of Technology, China
Di Wu, Shenzhen University, China
Sixing Yin, Beijing University of Posts and Telecommunications, China
Yang Yue, Xi'an Jiaotong University, China
Jianfeng Zhu, South China University of Technology, China
LOCAL ORGANIZING CHAIRS
Botao Feng, Shenzhen University, China
Weijun Hong, Beijing University of Posts and Telecommunications, China
Yanyan Liang, Macau University of Science and Technology, China
Xue Ren, Shenzhen University, China
PUBLICITY CHAIRS
Yuxiang Sun, Shenzhen University, China
June Tay, Singapore University of Social Sciences, Singapore
Liwei Yang, China Agricultural University, China
Xujian Zhao, Southwest University of Science and Technology, China
Danyang Zheng, Southwest Jiaotong University, China
SPECIAL SESSION CHAIR
Bo Li, Ningxia University, China
TECHNICAL PROGRAM COMMITTEE
Zhaopeng Xu, Pengcheng Laboratory, China
Xiong Youzhi, Sichuan
Normal University, China
Lei Xiong, Beijing Jiaotong University,
China
Fu Jia, Chongqing University of Posts and
Telecommunications, China
Mohit Sharma, Amazon Web Services (AWS),
India
Shuai Ma, Peng Cheng Laboratory, China
Shubham Malhotra,
Amazon, USA
Sajud Elinjulliparambil, Fama Technologies, USA
Chunguo Li, Southeast University, China
Xin Xu, Army Engineering
University of PLA, China
Chen Zhang,
Tianjin University of Technology and Education, China
Ceres
Dbritto, MasterCard Inc., USA
Satyanarayana Murthy Polisetty, Bank
of America, USA
Jiehan Zhou, Shandong University of Science and
Technology, China
Karan Kumar Ratra, Walmart Labs, USA
Raja
Chattopadhyay, Capital One, USA
Shouhua Zhang, University of Oulu,
Finland
Yasser M. Alginahi, Adrian College, USA
Shahzad Ashraf, Hohai
University, China
Sivaparthipan CB, Tagore Institute of Engineering
and Technology, India
Dragana Bajić, University of Novi Sad, Serbia
Paulo Batista, University of Évora, Portugal
Radhakrishna Bhat,
Manipal Institute of Technology, India
Huifang Chen, Zhejiang University, China
Tirumala Rao Chimpiri, Stony Brook University, USA
Stelvio Cimato, University of Milan, Italy
Wanyang Dai, Nanjing University, China
Mohanarangan Veerappermal
Devarajan, Ernst & Young (EY), USA
Yue Du, Qinghai Institute of
Technology, China
Thirusubramanian Ganesan,
Cognizant Technology Solutions, USA
Kalyan Gattupalli, Yash Tek
Inc, Canada
Tee Yee Kai, Universiti Tunku Abdul Rahman, Malaysia
Shri Kant, Sharda University, India
Soung-Yue Liew, Universiti
Tunku Abdul Rahman, Malaysia
Joel Lopes, Cruise LLC, USA
Tianming Ma, Shanghai University of Engineering Science, China
Vijaykumar Mamidala, Conga (Apttus), USA
Paolo Mercorelli, Leuphana
University of Lueneburg, Germany
Sreekar Peddi, Tek Leader Inc.,
USA
Poorva. R, SCSVMV University,
India
Luca Reggiani, Politecnico di Milano, Italy
Erica Teixeira
Gomes de Sousa, Federal Rural University of Pernamnuco, Brazil
Abdel-Badeeh M. Salem, Ain Shams University, Egypt
K. Ruba Soundar,
Mepco Schlenk Engineering College (Autonomous), India
Mario Tanda,
University of Naples Federico II, Italy
June Tay, Singapore
University of Social Sciences, Singapore
Weijie Tan, Guizhou University, China
Vinod Kumar Verma, Sant Longowal Institute of Engineering and Technology, India
Xuanzhong
Wang, Beijing Fibrlink Communications Co., LTD, China
Aulia Arif
Wardana, Wrocław University of Science and Technology, Poland
Yew
Kee Wong, Hong Kong Chu Hai College, China
Apostolos Xenakis,
University of Thessaly, Greece
Yong Xie, Qinghai Institute of
Technology, China
Rama Krishna Mani Kanta Yalla,
Amazon Web Services, USA
Akhil Raj Gaius Yallamelli, Amazon Web
Services Inc, USA
Fei Yuan, Ryerson University, Canada
* The above list is arranged by surname alphabet order